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Manufacturing Capability
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微笑、迅速、诚恳、灵巧、研究
Manufacturing Capabilities
| Description | Specification |
| Laminate | FR-4 (Tg140,Tg150,Tg170 etc.) |
| Halogen Free FR-4,CEM-3 |
| G10，High-Temp G10,Telfon |
| Surface Finishing | Gold Electro Plating |
| Electroless Nickel Immersion Gold (ENIG) |
| Lead Free H.A.L |
| OSP |
| Immersion Tin/Silver |
| Minimum Line Width/Spacing | 0.05mm |
| Minimum Finished Hole Size | Φ0.10mm |
| Thickness of Board |
|
| Single & Double Side | 0.1~3.2mm |
| Multilayer | 0.4~3.2mm |
| Maximum Board Size | 450mm ×650mm |
| Gold Thickness |
|
| Thick Gold | Up to 1um |
| Flash Gold | ≧0.025um |
| Low-Stress Nickel Thickness | ≧2.5um |
| Tolerance |
|
| 1. Non Plated-Through Hole | ±0.05mm |
| 2. Plated-Through Hole | ±0.08mm |
| 3. Outline | ±0.10mm |
| Registration Tolerance |
|
| 1. Drilled Hole To Drilled Hole | ±0.05mm |
| 2. Drilled Hole To Circuit Pattern | ±0.10mm |
| 3. Drilled Hole To Punched Hole | ±0.10mm |
| 4. Drilled Hole To Outline | ±0.10mm |
| (For 1.6mm Thickness of Laminate) |
|